Dusan Petranovic

2017 Edition. In Engineer of the Year

Dusan worked diligently with major foundries and OSATs to enable 2.5D and FO-WLP designs. The Mentor software he developed assures that multiple dies co-exist peacefully in an IC package. He developed a significant part of Mentor's recently announced die - package - board High Density Advanced Packaging (HDAP) design flow.