M-Series™, Deca Technologies

2018 Edition. In Device Technology of the Year

Wafer level fan-out packaging has been recognized as a technology with attributes that address many of the challenges the industry faces with more conventional approaches. M-Series addresses some of the key limitations the incumbent approaches faced courtesy of the adaptive processing combined with planar front side molding. The investment of over $110m in Deca by two of the giants of the industry is testimony to this technology.