Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
As advanced packaging continues to evolve within the semiconductor industry, it is necessary that materials be able to withstand the placement of complex dies into smaller and smaller packages. Indium Corporation works collaboratively with customers and other industry leaders to develop cutting-edge solutions for current and emerging advanced packaging challenges, such as heterogeneous integration, system-in-package, and the true no-clean fluxes for the next generation of compact design.
From water-soluble solder pastes to ultra-low residue no-clean fluxes, Indium Corporation’s technical experts have developed an industry-proven portfolio designed to provide enhanced reliability in heterogeneous integration and assembly and system-in-package (SiP) applications.
For more information about Indium Corporation, visit www.indium.com
Indium Corporation today announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material...
Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang,...
Indium Corporation experts will lead three presentations and a poster presentation at the 57th International Symposium on Microelectronics, organized by...
Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse® HR. The award was presented during an awards ceremony on September 11 at...
As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and...
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher...
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as...
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will deliver two technical presentations at...
Indium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17,...
Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6...