Latest Posts
IFTLE 407: Intel Lakefield Uses 3D Stacking; SEMI Europe’s 3D & System Summit
At CES 2019, Intel previewed a new client platform, code-named “Lakefield”. It featured the first iteration of its new innovative...HPC, AI and Datacenters: the 2.5D & 3D Stacking Technologies Playground
“2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI[1] and datacenter...
At AMD, Die Stacking Hits the Big Time
It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the...Endlich Freitag! 3D Buzz
Guten Tag! It’s Friday already? I’m not sure where that week went, but I managed to gather some interesting 3D...Taking the “pick” out of pick-and-place
Up until now, although it was possible to manufacture miniscule (e.g. 175µm square) RFID and wireless sensor chips using advanced...The Other 3D Packaging Technologies
While TSV developments continue to attract media attention as the rock star technology of 3D integration, it’s important to remember...
