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The chip industry can’t just continue to scale by focusing on transistor poly pitch or gate oxide thickness. The post Intel 18A Advanced Packaging is Key to Tech Leadership appeared first on EE Times.
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Send us a Text Message. This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to be Sustainability and Workforce Development. Today’s guests will address both these topics. […]
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U.S. government to support TI’s fab projects in Texas and Utah with $1.6 billion in direct funding and up to $8 billion in investment tax credits.
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The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More The post […]
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Send us a Text Message. The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows. The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit […]
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As TSMC fights to bring its new Arizona fabs online, the company learns the Taiwanese way isn’t going to work in America and needs to change.
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The semiconductor industry has integrated ever more functionality into smaller footprints and is starting to build upward. With the rise of three-dimensional integrated circuits (3D ICs), designers can pack more processing power and functionality into smaller spaces. However, this new dimension brings with it a host of challenges, including mechanical stresses and thermal effects, that […]
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Recent developments address imminent needs of advanced nodes and packages, but not all the pieces are in place yet. The post Metrology And Inspection For The Chiplet Era appeared first on Semiconductor Engineering.
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The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D. U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility was posted by Shannon Davis on Semiconductor Digest.
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Send us a Text Message. This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers […]
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Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device. Researchers Develop Device to Make Artificial Intelligence More Energy Efficient was posted by Shannon Davis on Semiconductor Digest.
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TSMC’s Kevin Zhang states that while Moore’s Law’s traditional focus on transistor density may be less relevant, TSMC’s continual advancements in technology scaling and 2.5D and 3D integration make it more than alive.
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Send us a Text Message. Recorded live at SEMICON West 2024, SEMI’s flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology. This episode features Françoise von Trapp’s conversation with Jose Fernandez, Under Secretary of Economic Growth, Energy, and The Environment for the Department of State, to […]
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The US Department of Commerce has signed a non-binding preliminary memorandum of terms (PMT) to provide GlobalWafers America LLC and MEMC LLC (subsidiaries of GlobalWafers Co Ltd of Hsinchu, Taiwan, the world’s third largest supplier of semiconductor wafers) up to $400m in proposed direct funding under the CHIPS and Science Act to help onshore critical […]
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Using formal to exhaustively verify all interconnections between IC blocks right after package planning and prototyping. The post Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity appeared first on Semiconductor Engineering.
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The CHIPS Act has spurred regional cross-border collaboration in Eastern Canada. The post Canada Bolsters NY Semiconductor Corridor appeared first on EE Times.
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Photolithography is still mainstream, but innovative new solutions are coming. The post Precision Patterning Options Emerge For Advanced Packaging appeared first on Semiconductor Engineering.
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Send us a Text Message. Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies. Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and […]
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Send us a Text Message. Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing […]
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The program will train facility technician apprentices over the next five years in Arizona. Intel Launches Its First US Apprenticeship for Manufacturing Facility Technicians was posted by Shannon Davis on Semiconductor Digest.
