Recommended Reads

A Conversation with SEMI’s Market Intelligence Team about ISS 2022 and the Semiconductor Manufacturing Monitor

Jan 19, 2023 | 3D InCites Podcast

For first episode of 2023, Françoise von Trapp handed over the microphone to Dean Freeman, the market analyst at 3D InCites. He attended SEMI’s Industry Strategy Symposium at Half Moon Bay, CA, in January and interviewed SEMI’s Market Intelligence team for the third episode in this four-part series. Part 3 focuses on the Semiconductor Manufacturing […]

Is AI Sustainable? Five Ways To Reduce Its Carbon Footprint – SemiEngineering

Jan 12, 2023 | SemiEngineering

Artificial intelligence (AI) can be part of the solution for tackling global warming – but it’s also a significant emitter of carbon itself. Can its net contribution be positive? The post Is AI Sustainable? Five Ways To Reduce Its Carbon Footprint appeared first on Semiconductor Engineering.

ICYMI: A Conversation about Addressing Material Challenges for Electric Mobility Technology

Jan 12, 2023 | 3D InCites Podcast

According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. […]

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging – SemiWiki

Dec 29, 2022 | SemiWiki.com

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More The post The Era of Chiplets […]

The March Toward Chiplets – SemiEngineering

Dec 15, 2022 | SemiEngineering

The benefits of heterogenous integration are well understood, but getting there isn’t easy. The post The March Toward Chiplets appeared first on Semiconductor Engineering.

A Conversation about the Future of Semiconductor Packaging and Test in Europe

Dec 15, 2022 | 3D InCites Podcast

This episode was recorded live during the Advanced Packaging Sympoisium at SEMICON Europa on November 16. 2022. Steffen Kröhnert, President & Founder, ESPAT-Consulting, moderates a panel discussion with members of the semiconductor packaging service provider community in Europe. The topic? The Future of semiconductor manufacturing in Europe – and specifically, back-end packaging and test. Kröhnert […]

Edge AI And Chiplets – SemiEngineering

Dec 08, 2022 | SemiEngineering

Why chiplets are a better choice for many applications than monolithic designs. The post Edge AI And Chiplets appeared first on Semiconductor Engineering.

A Conversation about Leveraging Generational Differences in the Shifting Workplace

Dec 08, 2022 | 3D InCites Podcast

In this episode recorded live at SEMICON Europa 2022, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe. At SEMICON Europa, Cassandra led a panel discussion on the topic of Leveraging Generational Differences in the Shifting Workplace. The panel comprised industry professionals representing different generational cohorts, […]

SEMICON Europa Member Spotlight: Conversations about the EU & US Chips Act and What’s New

Dec 01, 2022 | 3D InCites Podcast

In this episode, recorded live at SEMICON Europa in Munich the week of November 14-18, 2022, Françoise von Trapp speaks with 3D InCites member companies that either exhibited, presented, or in some cases, both, at the event. Conversations range from discussions about this year’s event compared with the 2021 show, the impact of the respective […]

Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) – SemiEngineering

Dec 01, 2022 | SemiEngineering

A technical paper titled “A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators” was published by researchers at CalTech and University of Southampton. “The resulting… » read more The post Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) appeared first on Semiconductor Engineering.

Is UCIe Really Universal? – SemiEngineering

Nov 23, 2022 | SemiEngineering

Why developing a multi-vendor standard for plug-and-play chiplets is so difficult. The post Is UCIe Really Universal? appeared first on Semiconductor Engineering.