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Technology will speed time to yield and add efficiency, but standards are needed for it to live up to its potential. The post Digital Twins Find Their Footing In IC Manufacturing appeared first on Semiconductor Engineering.
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Send us a Text Message. In this episode, Françoise von Trapp speaks with Christine King, the world’s first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir about her journey, called Breaking Through the Silicon Ceiling, which details her journey and […]
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New complexities include partitioning trade-offs, signal integrity across multiple substrates, and thermal behavior of stacked dies. The post Navigating Chiplet-Based Automotive Electronics Design With Advanced Tools And Flows appeared first on Semiconductor Engineering.
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The NSTC intends to allocate grants between $500,000 and $2 million to 10 workforce development projects.
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Send us a Text Message. Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent. In this episode, Françoise von Trapp speaks with Andreas Lippert, of Saxony Trade and Invest, and […]
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Our daily roundup from DAC 2024 day one. The post DAC 2024 Day One: Designing Chiplets and AI with RISC-V appeared first on EE Times.
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Lam Research’s PLD technique allows chipmakers to accelerate their product roadmaps and explore longer-range capabilities. The post Pulsed Laser Deposition at Wafer Level Is a Game Changer appeared first on EE Times.
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Send us a Text Message. Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the […]
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Quantum computing, once a futuristic concept limited to science fiction, is quickly becoming applicable in real-world scenarios. The post Quantum Computing Revolution Poised to Reshape Industries appeared first on EE Times.
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Averroes.ai conducted a study on the semiconductor industry’s funding, focusing on both government and private sector investments over the last five years. The objective of the study was to identify which countries have invested the most in this sector. Is the US Falling Behind in the Semiconductor Race? A $692.7 Billion Question was posted by […]
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Send us a Text Message. This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology […]
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The United States is on pace to add more investment into electronics manufacturing construction this year as it did from 1996 to 2023. The CHIPS Act is largely to credit for the meteoric growth.
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Several companies provided perspective at ECTC on the technologies needed to power the next industrial revolution: AI. The post Rapid AI and HPC Requires Collaboration and Co-optimization appeared first on EE Times.
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In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stockunas talk about SEMICON West’s Past, Present, and Future. The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members. Joe updates listeners on semiconductor […]
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Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out. The post The Race To Glass Substrates appeared first on Semiconductor Engineering.
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Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… […]
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Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials. This is paving the way for glass. In this episode, Françoise von Trapp and Richard Noack discuss […]
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A Penn State-led model to bring veterans into the chip industry could scale for broad workforce development. The post Veterans Could Close The Semi Industry’s Workforce Gap appeared first on Semiconductor Engineering.
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Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… […]
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2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More The post Siemens EDA Makes 3D IC Design More […]
