Featuring guest speakers from local fabs, the Rudolph Yield Forum™ provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges within advanced packaging, RF filter and MEMS device manufacturing.
Agenda
ADVANCED PACKAGING SESSION
2D/3D Metrology in Wafer-level Packaging
Fan-out Panel Level Packaging
True Bump Height Inspection and Metrology
RDL, CD and Dielectric Thickness Metrology
Improving Productivity with Offline Review
Die Seal Ring / Kerf Inspection and Metrology
Inline Defectivity/Metrology Process Control Solution for Advanced 3D Integration
High-speed Inspection of Non-visible Defects
Data Mining FDC Data to Prevent Issues
MEMS/RF FILTER SESSION
Bond Pad Height and Metal Residue Detection
Run-to-Run Controller for Lithography
Real Time, Interactive Data Visualization Dashboards
Process Tool Monitoring and Qualification
2D Defect Inspection: NSX Model Comparison 115 vs 330
Edge Bead Removal (EBR) Techniques
Automation Solutions for Non-Standard Wafers (MEMs, Thin, Warped, Taiko, and Frame)
*Agenda subject to change*
