Reliable, effective bonding technology is success-critical for today’s advanced packaging applications. This webinar will discuss current and emerging heterogeneous integration architectures, and technologies for achieving strong wafer-to-wafer bonds, advanced solder interconnects, and future structures using hybrid bonding. Various technologies and material systems used in temporary bond/debond for backside processing, and an exciting new reversable bonding technology for silicon and non-silicon substrates will also be discussed. Speakers include representations from Intel, Brewer Science, and YES.
Note that both sessions will cover identical material.
Thursday Dec 2, 9:00 Pacific Standard Time (US/UK/Europe time zones): Register here.
Friday Dec 3, 9:00 China Standard Time (Asia time zones): Register here.
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-value, high-throughput equipment for material and surface enhancement.