Glass has enormous potential for wafer-level packaging applications, due to its attractive thermal and electrical characteristics paired with low cost for the substrate. But so far, most of the industry is searching for an economical process to unlock this potential. Laser-induced deep etching (LIDE) is about to change this prospective fundamentally, as it is capable to fabricate high-precision and high aspect-ratio features in glass, completely free from defects at very low cost.
LPKF Laser & Electronics is hosting this webinar about the fundamentals of laser-induced deep etching and its potential for wafer-level packaging applications.
Presented by Rafael Santos, PhD
Click here to register.