SK Hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems recently presented a live seminar in the Bay Area discussing High Bandwidth Memory (HBM) designs implemented with 2.5D technology. The event was very well received, with over 100 people in attendance. The five companies are now bringing this HBM information to a worldwide audience with two webinars on Tuesday, March 29, 2016. The two live webinar events will occur at 8:00 AM and 6:00 PM Pacific Daylight Time.
HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. This webinar will present a complete HBM supply chain that is delivering and supporting customer HBM designs now. Webinar attendees will also receive an informative white paper on HBM design.
Webinar registration is now open:
• HBM webinar registration
• HBM webinar information and Agenda
