SiP Conference China 2021 (– the Advanced System in Package Technology Conference and Exhibition) will be co-located with the “ELEXCON” Shenzhen International Electronics Exhibition and Embedded System Exhibition at the September 1-3, 2021 (the Exhibition will be at September 1-3, the Conference at September 2-3). It is widely regarded as the most prominent SiP Conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise and all aspects of the SiP design chain, including assembly and test from OSAT, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries as well as material and equipment suppliers.
From 2017 to 2019, SiP Conference China attracted more than 220 enterprises to participate in, there are China, the United States, France, Germany, Italy, the Netherlands, Japan, South Korea, India, Malaysia, Singapore and other countries and regions, realized from SiP China to SiP World, frontier technology communication and high-end circle layer fusion. In 2021, the Fifth SiP Conference China will set up two branch venues, Shanghai and Shenzhen. Aiming to fully radiate the SiP packaging industry clusters to meet the booming 5G industry chain, such as the demand for smart wearables, smart phones and other product lines.
For more information visit: https://www.elexcon.com/sip/en/index.html