03/10/2021 -11:30 am

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MEPTEC & IMAPS Semiconductor Speaker Series
John Park – Cadence Design Systems
“An EDA Perspective: What’s the Difference Between Heterogenous Integration and System in Package (SiP)”
There is a new flavor of System in a Package (SiP) emerging as Moore’s Law slows. This presentation will help to explain this new SiP technology and how the term Heterogenous Integration is tightly coupled with it. This presentation will also outline some of the design and analysis challenges of these new chiplet-based architectures.


Mar 10, 2021 11:30 AM in Pacific Time (US and Canada)

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