3D IC Forum at SEMICON Singapore

05/07/2013 - 05/09/2013 -9:00 am - 5:00 pm

Location: Marina Bay Sands Expo

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SEMICON Singapore is a key Southeast Asia event providing updated trends and technologies from the semiconductor industry. This year’s program is rich in topics of interest to 2.5D and 3D enthusiasts.

On Tuesday, May 7, 2013, from 2-4pm Tokyo Electron will be hosting it’s own seminar, Addressing Challenges in 3D Packaging to showcase the company’s tool capabilities and that of its subsidiary, Tel-NEXX.

The 3D IC Pavilion features exhibitors at SEMICON Singapore who wish to promote their products and services in the making of 3D IC devices.

The main event, the 2.5D/3DIC Forum, takes place May 8, from 9:30-5:30pm, and features two sessions.

The theme for the morning session, chaired by Applied Materials’ Sesh Ramaswami, is Wafer-Level Packaging for 2.5/3D Poised for Production: Controlling Variations. This program presents an overview of the production-readiness of 2.5 and 3D approaches, complemented by perspectives on implementation from an OSAT production line.

The theme of the afternoon session, chaired by IME’s Surya Bhattacharya, is The Road to Volume Production of 2.5D/3D ICs. Over the past few years, advances in Silicon fabrication, assembly, packaging technologies coupled with improvements in EDA design capabilities have made the realization of 2.5D, 3DICs possible.  Companies in both logic, memory, and imaging space have released products using 2.5D, 3D IC technology.  Most companies are including 2.5D/3DIC as part of technology exploration space while developing new products.  The next phase of this evolution is the path to volume manufacturing.  This is the focus of this year’s 2.5D/3D IC forum.  As has been accepted across the industry, a collaborative approach is necessary for the industry to successfully drive up the demand and manufacturing volumes for 2.5D/3D ICs.  To better understand challenges that are encountered and anticipated in high volume manufacturing, we have included experts from fabless, IDM, EDA, Foundry, OSAT, Equipment, Materials companies.

Visit the 2.5D/3DIC Forum Page on the SEMICON Singapore website for the full agenda and registration information.