Here’s what the 3D integration enthusiasts should attend at SEMICON China 2014:
Advanced Packaging Technology Forum
In conjunction with SEMICON China 2014, SEMI China will organize Advanced Packaging Technology Forum, which will discuss the solution of Advanced Packaging, including 2.5D/3D packaging, WLP, Cu Pillar, High density TSV technologies, and analyze the market trend of these technologies. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.
The TSV Pavilion is an added exhibition section in SEMICON China and will supply a platform to display key equipments in current TSV technology, TVS packaging materials and relevant technical service from the perspective of electronic system application and market demand.
Brief Analysis on TSV Market
To comply with the eternal theme that electronic products are developing to meet the market demand of “lighter, thinner, shorter and smaller”, TSV will gradually become a key technology for future IC industry.
Before 2013, the output value of TSV will account for 5-6% of the semiconductor device market with nearly USD 14 – 17 billion; memory industry is an important field in TSV technology application and it is estimated that TSV will take up about USD 4 – 5 billion of total memory output. (Stromberg Data)
The development of TSV technology will bring a huge opportunity for three sectors: semiconductor equipment, materials and service. In terms of equipment, the scale of market value is expected to reach USD 12 billion with materials and services end respectively USD 625 million and USD 2.2 billion. (Stromberg Data)
Partner Event: TSV Manufacturing Solution Workshop by Applied Materials
Instructed by Sesh Ramaswami, Ganming Zhao, Loke Yuen Wong, all of Applied Materials, this workshop, which takes place on March 17, 2014, will feature:
- Market review and Applied Materials competencies in advanced packaging
- Integration learnings for interposer, via middle, via reveal and via last
- Pillar and RDL electrochemical deposition technologies
- TSV etch technology
- CVD liner and low temp CVD technology
- PVD barrier/seed for TSV and UBM
- TSV copper fill
- CMP applications in TSV