Road to Chiplets: Architecture Workshop

Online July 13 & 14, 2021
8:00 – 11:00 am Pacific Time (PDT)

The concept of “Chiplets” – integrating multiple die smaller than complete “stand alone” semiconductor devices using advanced packaging – has firmly captured the attention of the semiconductor industry. The foundational technologies to enable this advanced packaging have been explored in detailed at industry events. MEPTEC through a series of events will cover the practical aspects of designing, implementing (packaging), and testing Chiplets as this cross-functional knowledge is critical to transitioning such devices from science projects to commercial reality.

“Data infrastructure and chiplets”
Sandeep Bharathi, Executive Vice President, Central Engineering, System-on-Chip Group, Marvell

“Are Chiplets the new Hard IP?”
Ming Zhang, Architect, Synopsys

“Test Challenges & Directions as the industry moves to 3D Heterogeneous Products”
Phil Nigh, Distinguished Technical Staff Member, Broadcom

“Pathfinding and Design of Large-Scale Chiplet-Based Systems”
Puneet Gupta, Faculty Member with the Electrical and Computer Engineering Department, University of California at Los Angeles

“Design of Heterogeneous Integrated Circuits–Chiplets, Modeling, and Data Exchange”
Jawad Nasrullah

“The Open Domain-Specific Architecture: A Status Update”
Bapi Vinnakota, System Architect, Broadcom

“TBA”
Robert Munoz, Systems Engineer and Solution Architect, Intel

“Are current approaches to reliability assurance going to be adequate in the era of chiplets and heterogeneous integration?”
Abhijit Dasgupta, Jeong H. Kim Professor of Mechanical Engineering, University of Maryland (UMD)

We look forward to having you join us online for the Road to Chiplets: Architecture Workshop!

Jaspreet Gandhi, Xilinx
Ravi Mahajan, Intel
Ira Feldman, MEPTEC & Feldman Engineering
Road to Chiplets: Architecture Technical Program Committee