04/26/2018 -All Day

Location: NextFlex

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Don’t miss the first MEPTEC event to cover exclusively Assembly and Packaging requirements for a new generation of flexible hybrid electronics. In this one day event, you will hear from experts that will help you understand the need for flexibility, thinness and ultralow power consumption for emerging applications.

Keynotes Speakers 

  • Wilfried Bair, NextFlex will discuss how flexible hybrid electronics are disrupting conventional packaging and system design solutions.
  • Joe Fjelstad, Verdant Electronics, shares an alternative history of the electronics manufacturing industry.


  • Dr. Norman Chang is the Chief Technologist of the Semiconductor Business Unit of ANSYS, Inc. and is also the founder of Apache Design Solutions. Dr. Chang will discuss Emerging challenges of power/reliability analysis for Flexible Hybrid Electronics.
  • Dr. Geraud DuBois is the Head of Data-Driven Science to Solutions Organization and Principal Research Staff Member at IBM Research, and Adjunct Professor at Stanford University. Dr. DuBois will present Advanced low dielectric constant materials: leaning and perspectives.
  • Dr. Tsung-Ching “Jim” Huang is a senior research scientist with Hewlett-Packard Labs (HPE Labs) in Palo Alto, CA. Dr. Huang authored a book “Design, Automation, and Test for Low-Power and Reliable Flexible Electronics” – the first book dedicated to circuit design and design automation with flexible electronics. He will discuss HP Lab’sProcess design kit (PDK) for flexible hybrid electronics.
  • Dr. Xina Quan is a Co-founder and CTO of pyramids (a Stanford University spin-out). Among many other endeavors, she has managed product development and research programs at Bayer MaterialScience, Lumileds Lighting, and AT&T/Lucent Technologies Bell Laboratories. Dr. Quan will be discussing Improving health through continuous blood pressure monitoring.Register now!