05/25/2016 -11:30 am - 1:00 pm

Location: SEMI Headquarters

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Topic:      Innovations in Heterogeneous Integration and SiP
Speaker:  William (Bill) Chen, ASE Fellow and Senior Technical Advisor, ASE Group

Bill Chen will discuss the crucial role of the heterogeneous integration through SiP, increasingly being applied within the broad electronic device market and quickly meeting the challenges associated with the emerging internet of things (IoT) and migration to the cloud. Chen will explore the reinvention of core packaging technologies and the emergence of new innovations as platforms for SiP. In tracing the development of Fan Out from Fan In packages, he will then demonstrate how this new core technology has great potential to meet the complex challenges of integration and miniaturization posed by a demanding marketplace.