Join us at SEMI HQ in San Jose on Tuesday 28 June 2016 at 11:30am for the next MEPTEC Monthly West Coast Luncheon.
Emerging IC Packaging Platforms for High-Performance ICT Systems
Presented by Li Li, Distinguished Engineer, Cisco Systems, Inc.
To meet the requirements of next-generation information and communications technology (ICT) systems, the packaging technology has to evolve along with the IC technology scaling. At the same time, design and development of packages have to meet cost, performance, form factor and reliability goals. In this talk, we will examine new advances in packaging technology to maintain the IC scaling edge, as well as the role of new emerging 2.5D and 3D IC packaging platforms for addressing the gaps seen between the slowdown of Moore’s law scaling and the ever increasing system integration requirements. We will also discuss the emerging component technologies such as 3D stacked high-bandwidth DRAM (HBM) and the implications on supply chain ecosystems for enabling the 3D System-in-Package (SiP) solutions for integrating ASIC and HBM for networking applications.
More information here.