Join host Amkor Technology at this year’s IPC Conference on Component Technology in Chandler, Arizona. This year conference is focused on guiding PCB supply chain and chip manufacturers through the challenges that are involved with IC-to-board-level interconnections.
Day one of the conference will see two technical workshops: “Design and Fabrication of Semiconductor Package Interposers and Substrates for Today’s Demanding Applications” led by Phil Marcoux, Director of PPM Associates, and “System Integration and Design Challenges” led by Nozad Karim, VP of Electrical Engineering and Characterization at Amkor Technology.
The following day will begin with a keynote given by Ron Huemoeller, Senior VP of Advanced Product Development at Amkor, discussing the package/system integration level. There will also be technical paper presentations given by representatives from Invensas, Lenovo, Intel, PCB, TechSearch, and more. After the conference on September 11, Amkor will host a reception for attendants.
Registration is still open and a discounted room rate is available until August 20, so register soon here.
