The first International Symposium on 3D Power Electronics Integration and Manufacturing, to be held June 13-15, 2016, in Raleigh, North Carolina, brings together designers and manufacturers to address the future of integrated power electronics design and advance the 3D power electronics systems of the future.
The 3D-PEIM Symposium will kick-off on Monday morning, June 13th, with a series of tutorials dealing with “the world of packaging and critical issues” in 3D integration. Seminars will then continue over three days covering manufacturing techniques, modeling and simulation, materials, passive components, and quality and reliability. Evening receptions on Monday and Tuesday evening will provide opportunities for networking and discussions with vendors displaying the latest technologies.
The 3D-PEIM symposium is underwritten by the Power Sources Manufacturers Association (PSMA) and is supported by: the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); the International Microelectronics Assembly and Packaging Society (IMAPS); North Carolina State University; the University of Maryland; and Virginia Tech.
“This symposium is all about electrical-physical design and the manufacturing of power sources,” said Doug Hopkins, PhD., Professor of Electrical Engineering at NC State and Chairman of 3D-PEIM. “Since we expect nearly everyone will have an interest in ‘physical’ circuits, we’re offering both dialogue and lecture speakers the opportunity to display their hardware during the breaks and receptions.” According to Hopkins, the symposium also offers tutorials to provide “background and insight into many of the traditional physical design approaches and technologies.”