Colocated with IMAPS Device Packaging Conference, this year’s Global Business Council (GBC) Spring Conference and Marketing Forum promises to bring attendees the latest information on business models, industry collaboration, and market dynamics, and the profound impact this has on the increasingly interconnected semiconductor supply chains.
This year’s program features a morning session on Medical Electronics Trends for Evolving Healthcare Ecosystems, while the afternoon session discusses Trends in Microelectronics & Factors Shaping Enabling Technologies. The lunch keynote will be presented by IC Insights’ president Bill Mclean, who will talk about “The ‘New’ IC Industry Cycle Model”.
While the entire line-up of speakers is impressive and spans the realm of critcial areas from MEMS to Materials, 3D IC enthusiasts should make sure to attend Latest Trends in Advanced Packaging Technologies and Focus on Medical Applications, during which Lionel Cadix of Yole Developpment will talk about 3D ICs in medical electronic applciations. In the afternoon, make sure to catch the presentation given by Jean Trewhella, Director of IBM’s Packaging Research and Development Center, who will focus her talk on Supply Chain Eco-systems for Next Generation 3D and High-density Flip Chip Interconnection.
For more information and the complete agenda, visit the GBC Spring Conference website.
