10/26/2015 - 10/29/2015 -All Day

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The 48th International Symposium on Microelectronics (IMAPS 2015) is organized by the International Microelectronics Assembly and Packaging Society (IMAPS).The Symposium, which takes place October 26-29, 2015 at the Rosen Centre Hotel in Orlando, FL, will feature 5 technical tracks that span the three days of sessions on: Packaging the Internet of Things: Leading the Race from Technology to Systems; Interposers and 2.5D/3D Packaging; Advanced Packaging and Enabling Technologies;Advanced Materials and Processes; Modeling; Design; Test and Reliability; as well as the Interactive University Poster Session.

Overall, IMAPS 2015 will cover three tiers of electronics:

  • Systems and Applications
  • Design and related measurements
  • Materials, Process and Reliability

IMAPS 2015 will feature 5-6 technical tracks that span the two and a half days of sessions on:

    • Interposers and 2.5D/3D Packaging
    • The future of Packaging
    • Advanced Packaging
    • Interconnects and Assembly
    • Materials and Processes
    • Modeling, Design and Test
    • System Integration
    • Power and High reliability
    • Interactive Student Poster Session.

Visit the IMAPS 2015 website for registration and program details as they become available.