The IEEE 2015 International 3D Systems Integration Conference (IEEE 3D IC 2015) will be held at the International Center in Sendai, Japan in August 31-Sepember 2, 2015. This conference combines the previous ASET and IEEE EDS Japan sponsored International 3D System Integration Conference, held in Tokyo in 2007 & 2008 and the IEEE CPMT sponsored 3D System Integration Conference held in 2003 & 2007 in Munich. After the first combined conference in San Francisco in 2009, the 2nd IEEE International Conference on 3D System Integration was held in Munich in 2010, the 3rd conference in Osaka in 2012, the forth conference in San Francisco in 2013 and the fifth conference in Cork in 2014. The IEEE 3DIC 2015 will cover all 3D integration topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world.
For program details, visit the IEEE 3D IC websites.