|Glass has enormous potential in IC Packaging. LPKF’s glass micro-processing division, Vitrion, has proven the ability for glass to be fabricated with superior performance for IC packaging applications, due to its attractive thermal and electrical characteristics paired with low cost for the substrate. Currently, many companies in the industry are searching for an economical process to unlock this potential. The Laser-Induced Deep Etching process (LIDE) is changing this paradigm at a fundamental level, and leading to a rethink of how and where glass should be used in the semiconductor industry.|
LPKF Laser & Electronics is hosting this webinar about the fundamentals of laser-induced deep etching and its potential for wafer-level packaging applications.
Monday, June 28th, 2021 at 11:00 AM Pacific Time.