The theme of SEMI’s 2018 European 3D Summit is Heterogeneous Integration drives 3D integration. Attendees will discover a wider scope of 3D topics that include 3DIC, TSV technology, 2.5D and 3D FO-WLP/ e-WLB.
Don’t miss the featured keynote from Bob Sankman, Director, Assembly Technology Pathfinding, Intel: Opportunities and Challenges in 3D Stacked Components
The event kicks off with a market briefing to highlight the latest business challenges and opportunities in the 3D sector. Attendees will hear from several 3D and packaging industry experts who will present their exclusive business & market insights and reverse engineering analysis confirming the huge growth of advanced packaging as forecasted. The plenary sessions will feature more than 25 invited high-level speakers will share their views, and present their choices and strategies among the 3D Integration technologies palette, giving particular attention to current adoption for applications such as high-end memories, performance applications, mobile, imaging and automotive. An Exhibition zone will be located at the heart of the venue, enabling companies to display their products and services to decision makers.
Moreover, SEMI will provide attendees with numerous networking opportunities throughout the events, including networking lunches, one-on-one business meeting services, coffee breaks and a gala dinner.