The Electronic Design Processes Symposium (EDPS 2015) in its 22th year, fosters the free exchange of ideas among the top thinkers, movers, and shakers who focus on how chips and systems are designed in the electronics industry. It provided a forum for this cross-section of the Design community to discuss state-of-the-art improvements to electronics design processes and CAD methodologies, rather than on the functions of the individual tools themselves.
This year’s program features a session titled Multi-die Challenges and Applications, moderated by Herb Reiter, of eda2asic, Si2 and 3D in Context. Herb will open the program with a presentation titled, 3D-IC EcoSystem Today and What’s Next. The session will also feature Cadence’s Brandon Wang, who will discuss a Versatile 3D-IC Design Environment. Dusan Petranovic, Mentor Graphics will talk about Verification and Extraction of 3D Stack Components Interaction, and ASE’s Rich Rice will bring the manufacturing perspective with a talk, Multi-Die Packaging — How Ready Are We?
Visit the website for the complete program and to register.