The SEMI Advanced Semiconductor Manufacturing Conference continues to fill a critical need in our industry. The conference provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The conference is co-chaired by Stefan Radloff, Intel Corporation; and Russell Dover, Brion Technologies (an ASML Company).
ASMC 2013 schedule includes keynotes, tutorials, a panel, 15 technical sessions, including the popular interactive poster session/reception. On-site registration opens May 13 at 6:30pm. After picking up your conference materials, join your fellow attendees at the ASMC 2013 Welcome Reception for an excellent networking opportunity prior to the conference. Of particular interest to 3D IC enthusiasts, this year’s agenda features a 3DTSV session that will cover key innovation in the field of 3D/Through-silicon via technology (TSV) including TSV processing, The session is chaired by Hamid Khorram, Nikon; James Lu, RPI; Thuy Tran-Quinn, IBM. Thursday, May 16 will feature a 3D IC tutorial lead by Sarasvathi Thangaraju, Package Technology and Integration,GLOBALFOUNDRIES.
For the complete agenda and to register for the event, visit the ASMC 2013 Web site.
