Advanced packages have enabled the industry to develop new flip-chip processes, 2.5D interposer and TSV technology, and 2D and 3D fan-out processes with high densities of connections in the smallest of spaces. With these new innovations, the need for flexibility in wafer metrology and handling has exploded. FormFactor MicroProf® AP metrology tools are specifically designed to address an extensive list of advanced packaging format and application challenges.
DISCO Hi-Tec Europe, a technological leader in grinding and dicing processes, will discuss how they perform advanced metrology using FormFactor FRT MicroProf® AP multi-sensor tools equipped with SurfaceSens™ technology to ensure the highest quality control of these processes.
Join us for this webinar to learn about:
- Metrology applications in advanced packaging
- Best practices and tips for grinding and dicing processes
- How the FRT MicroProf® helps support the highest quality control of processes
Wednesday October 13, 2021, 9:00am China Standard Time
Wednesday October 13, 2021, 9:00am PDT / 12:00pm EDT / 6:00pm CEST