04/21/2016 - 04/22/2016 -9:00 am - 6:00 am

Location: National Center for Advanced Packaging

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From April 21 to 22 – Wuxi, China – Powered by Yole Développement – Hosted by NCAP China

For the 2nd time, Yole Développement & NCAP signed a partnership to organize the Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology. The dedicated symposium will take place in one of the most dynamic place in the field of advanced packaging: Wuxi , China, from April 21 to 22, 2016.

Yole Développement & NCAP seminar includes lot of valuable presentations on: Interposer & 3D integration – Sensors & MEMS technologies – Si Photonics.

This 1,5 day of conference would include presentations on Interposer and 3D Integration Technologies, Fan Out & Embedded Technologies, Packaging for IoT, Advanced Substrates & System in Package, Sensors & MEMS Packages, Silicon Photonics and others …. There will also have time for networking and a Panel discussion around: Is the Supply Chain ready to support the latest advancements in Packaging?
Speakers and more detailed program to be announced soon…

Registration online are now available, please click here, or access the registration form to complete and return to Clotilde fabre (fabre@yole.fr).
Early bird rate*: EUR 300 (2200 CNY) by March 16, 2016, tax included
Standard rate*: EUR 380 (2800 CNY) after March 16, 2016, tax included

Registration form: Here.

Based on its expertise and its strong knowledlink_NCAP_yole_symposium_200x200ge of the industry, the “More than Moore” market research and strategy consulting company,
Yole Développement shall detail the technology roadmap and give a comprehensive market outlook. Yole Développement’s experts and invited speakers will be part of this strategic conference… Detailed info. will come soon.

Make sure you will be at the right place at the right time, and register today!

Source: www.yole.fr