9th ESTC (Electronics System-Integration Technology Conference)
September 13-16, 2022, in Sibiu (Hermannstadt), Romania,
Organized and supported by IEEE EPS (Electronics Packaging Society) and IMAPS Europe.
ESTC is the premier international event in Europe for academics and industry to present and discuss the latest developments in packaging, assembly and interconnection technologies and new applications. ESTC completes the successful triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.
Sponsorship and exhibitor packages available.
If you are interested, reach out to Rajmond.Jano@ael.utcluj.ro and steffen.kroehnert@espat-consulting.com
Call for Sponsors:
https://www.estc-conference.net/fileadmin/documents/2022_CfS_ESTC_03.pdf
Call for Exhibitors:
https://www.estc-conference.net/fileadmin/documents/2022_CfE_ESTC_01.pdf
More information about ESTC
https://www.estc-conference.net/home
