The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, and Medical electronics markets.
IMAPS is consulting government agencies, event partners, and our stakeholders regarding the Covid-19 virus ahead of IMAPS 2021 San Diego. We will keep attendees informed of any effects to the event. IMAPS remains committed to delivering the best Symposium this Fall and anticipates a robust, healthy event for all of our attendees, speakers, and exhibitors. We are exploring all options for alternative conference plans including virtual presentation options and other online tools in the event that the in-person components of the Symposium are deemed unsafe or not possible and will be prepared to offer all in-person, virtual and/or blended meeting options for all.
IMAPS 2021 program is packed with keynote presentations from top experts, Professional Development Courses, numerous technical sessions and over a dozen posters. For a full list of topics and presenters, click here.
PROFESSIONAL DEVELOPMENT COURSES
PDCs will be offered on Monday, October 11 from 8AM-5:30PM Pacific Time
Wednesday, October 13, 2021 | 6:00-7:30pm Pacific
Next Generation Packages: Are We Ready?
Moderator: Jan Vardaman, TechSearch International
Heterogenous Integration Roadmap
Wafer Level/Panel Level (Advanced RDL)
High Performance-High Reliability
Advanced Packaging (Flip Chip/2.5D/3D/Optical)
Advanced Process & Materials (Enabling Technologies)
Currently, there are thirteen posters sessions scheduled for the Symposium.