06/21/2021 - 07/31/2021 -12:00 am

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This year’s IEEE International 3D System Integration Conference (3DIC 2021) will be held in November. It will be a hybrid physical/virtual event. The live conference will be held at North Carolina State University in Raleigh, NC. The virtual conference will be held concurrently. Authors and attendees can choose either format to interact with 3D researchers from all around the world. Presentation abstracts and proposals for panels and tutorials should be submitted via this “Abstract ScoreCard” application. The deadline for paper abstracts and panel/tutorial proposals is July 31, 2021. Abstracts should be about 500 words in length; some figures and tables can be included. Notifications will occur by Sep 15 and full papers in IEEE format will be required by October 15, 2021.

Abstracts for papers are solicited on all 3D IC topics including, but not limited to, the following:

Technology:  Materials, equipment, wafer handling, diverse substrates, Through Silicon Vias (TSV), alignment, bonding (thermo-compression, electrostatic, hybrid, temporary adhesive), de-bonding, wafer cleaning, thinning, dicing, chiplets, interposers (active, passive), 3D integration (monolithic, heterogeneous), capacitive coupling, inductive coupling, multilevel epitaxial growth, etc.

Design and CAD:  Synthesis, design flows, signal design, power integrity, thermal considerations, mechanical stress, reliability, test, techniques, analysis, etc.  Applications to be considered may include imaging, memory, processors, communications, networking, wireless, biomedical, sensors, SOC, MEMS, DSP, FPGA, RF, microwave, millimeter wave, analog circuits, biomedical circuits, photonics, optoelectronics, etc.

  • Abstracts should be about 500 words in length
  • Some figures and tables can be included
  • The deadline for submissions is July 31
  • Notifications will occur by August 31
  • Full papers in IEEE format will be required by September 30

Submit here