Join us Thursday, July 16, 2015 from 8-10am, at the Impress Lounge for the 3rd Annual 3D InCites Awards Breakfast, sponsored by Micron, as we recognize the winners of this prestigious industry award, established to acknowledge those who have contributed significantly to the advancement of through silicon via (TSV) technologies and other innovative processes that enable interposer integration, 3D ICs, monolithic 3D, 3D memory, and 3D heterogeneous integration. Scott Jones, director,Semiconductor Practice Lead, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure. Jones has 15 years of experience in consulting in the semiconductor industry. Prior to his work with AlixPartners, Jones was a senior associate with JP Morgan in their Equity Research group, recognized as the number one research team on Wall Street in the technology sector. He began his career working with Intel Corporation as a finance manager in their Enterprise Products Group, and has consulted with hedge funds and private equity firms on investment portfolio decisions and published extensive research on the technology industry.
Following the keynote, the awards will be presented to the winners in the following categories:
- Devices (including interposer, 3D IC, 3D Memory, Heterogeneous Integration)
- Design Tools (includes EDA and Design for Test)
- Processes
- Materials
- Manufacturing Equipment (includes handling equipment)
- Inspection/Metrology Tools
- Test Tools/Equipment (includes probe cards/testers)
- Reader’s Choice Award.
Additionally, representatives from the Frances B. Hugle Engineering Scholarship and SEMI High Tech U will speak about their respective programs, and will be presented with checks representing contributions to their causes. For more information visit the 3D InCites Awards page. Mentor Graphics and Yole Developpement is a silver sponsor of this year’s event.
Bookings
Bookings are closed for this event.
