Successful introduction of 3D interconnects will require that equipment suppliers and manufacturers overcome the inspection and metrology challenges that arise throughout the 3D process flow.
Inspection and metrology for 3D architectures requires new techniques, revisiting and improving some older techniques, and breakthrough innovations to create new tools. This workshop, held in conjunction with SEMICON West, focuses on how new and existing inspection and metrology technologies can be utilized, modified or enhanced to measure and improve 3D interconnect processes.
This workshop will benefit researchers, IC manufacturers, back-end foundries, equipment and material suppliers, unit process engineers and metrologists responsible for the development and/or implementation of 3D interconnect technology.
To register click here.