10/13/2020 - 10/15/2020 -12:00 am

Location: DoubleTree by Hilton Hotel

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Bridging the Boundaries: Wafer, Panel and Beyond

Chip Scale Review and the SMTA are pleased to announce the 17th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition.This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications.

There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

The conference includes three tracks with two days of technical paper presentations covering: Wafer-Level, 2.5D & 3D packaging, and Advanced Manufacturing & Test, as well as Professional Development Courses (PDC’s).

Wafer-Level Packaging:
Wafer Level Chip Scale Packaging (WLCSP), Flip-chip, Fan-Out and Redistribution, Wafer and Device Cleaning, MEMS, sensors, Nanotechnology, Quality, Reliability, and COO.

3D Package Integration:
3D WLP, Thru Silicon Vias (TSV), Thru Glass Vias (TGV), Silicon Interposers, Stacking Processes (W2W, D2W, D2D), IC Packaging Substrates, TSV Integration methods (FEOL vs BEOL), Package-on-Package (PoP), embedded die and passives, and EMI shielding methods.

Advanced Wafer-Level Manufacturing and Test:
Advances in wafer-level manufacturing processes, equipment and materials including: novel process or material technologies, improved equipment throughput and productivity, control methodologies (SPC, APC, FDC), factory output & cycle time improvements, advanced automation technologies, warped wafer handling, wafer level test methods, wafer level vs. singulated unit test for WLP, and TSV test methods.

Professional Development Courses:
Now accepting abstracts from instructors looking to instruct PDC’s on topics relevant to conference topics and structured to combine field experience with scientific research to solve everyday problems. Abstracts should include course objective, topics covered and intended audience for the course.

Find out more at https://www.iwlpc.com/