04/12/2021 - 04/15/2021 -12:00 am

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The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

What to Expect

The Device Packaging Conference packs a punch with four days of programming. Attendees can expect:
  • A hit keynote speaker lineup and more than 60 session speakers across 3 technical tracks
  • A full slate of professional development courses from the industry’s best instructors
  • The most popular poster session of the year
  • A Global Business Council session featuring speakers from across the industry
  • An evening panel session

Professional Development Courses

DPC 2021 will offer supplementary classroom-style education in the form of two-hour short courses taught by industry leaders. Expect more than ten PDC courses when the lineup is announced in early winter.

Interested in teaching a course? Course proposals can be submitted online.

Sponsorship and Exhibitor Opportunities

The Device Packaging exhibition and sponsorship opportunities are some of our most popular on the entire IMAPS calendar! Stay tuned for a corporate partnership prospectus release in early-January 2021. The full sponsorship menu, commitment timeline, and pricing will be announced in the prospectus.

Click here to view highlights from DPC 2020.