The 13th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 6-9, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Featuring 3 Topical Workshop Tracks:
- Interposers & 3D IC & Packaging;
- Flip Chip, Wafer Level Packaging & Fan-Out
- Engineered Micro Systems/Devices (including MEMS, Sensors & 3D Printing)
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. The exhibits have sold out every year since 2006 and HAVE SOLD OUT AGAIN IN 2017!
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 6th, preceding the technical conference. PDC details and registration on-line soon.
For more information or to register, visit the website.
