3D Integration 101: Explore, Learn, Share

Resource Library
Jun 27, 2014 · By Francoise von Trapp · 3D IC

See What the IMAPS 59th Symposium on Microelectronics Exhibit Hall Has in Store!

Thank you to our valued IMAPS exhibitors for your continued...

IMAPS 59th International Symposium on Microelectronics: Technical Program and Exhibition Focused on Intelligent Packaging for the AI Era (Heterogeneous Integration & Photonics)

The International Microelectronics Assembly and Packaging Society (IMAPS) will host...

Warpage in Fan-Out Wafer-Level Packaging: Challenges and Research Directions at Arizona State University

Fan-out wafer-level packaging (FOWLP) has become one of the most...

The Next Mode of Transformation: 3D IC Integration

The semiconductor industry finds itself at a critical juncture, where...

IFTLE 646: TSMC 3Dblox 2.0 Helps Advanced Packaging Designs

The 3Dblox Open Standard Continues to Evolve Introduced in 2022,...

The 3DICAMA and Other Efforts to Develop the 3D IC Ecosystem

This Fall has been a busy time for semiconductor events....