Latest Posts
TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends
Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these...
At 3D ASIP 2015, Variety is the Spice of Life
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop
More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC...
Chasing the Fan-out Wafer Level Packaging Rabbit at IWLPC 2015
Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer...
Amkor Execs Outline Strategy for the Future of Advanced Packaging
I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was...
TechSearch International Makes Sense of Package Alphabet Soup
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the...
