Latest Posts
SUSS MicroTec Brings 3D IC Laser Debonding to Fraunhofer IZM
SUSS MicroTec announced the installation of its ELP300 excimer laser stepper to support next-generation advanced packaging and 3D IC laser... Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components...
3D IC Reality Check
The good news: While forecasted dates for 3D IC volume manufacturing continues to be pushed out, clearly foundries and OSATS are...
European 3D TSV Summit: Focus on Cost of Ownership
Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned...Notes from the Exhibition Hall
I have to admit that this year at IMAPS Device Packaging Conference, I spent more time attending technical sessions and...Following the 3D innovation path to profitability
In last week’s email update, I talked about the pendulum starting to swing back the other way, albeit ever so...3D companies address critical areas
It’s only Tuesday, and already, it’s been a productive week for 3D news.Brewer Science and SUSS MicroTec Jointly Commercialize ZoneBOND™ Technology for Thin Wafer Handling
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling,...SUSS MicroTec Appoints New VP R&D
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as VP R&D and CTO. In this function Rainer Knippelmeyer will oversee research...
