Latest Posts - Page 2
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
StratEdge Improves Performance of Leaded Power Amplifier Packages, Now Supporting DC to 28GHz Devices
Santee, Calif. — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF,...
StratEdge Glass Side Wall Packages: Straightforward Packaging Solutions for Mil-Std Applications
Santee, Calif. — 17 November 2022 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power...
The Power of Community at the IMAPS International Symposium
One of the things I love most about being part of the International Microelectronics and Packaging Society (IMAPS) is the...
Community Member Monthly Highlights – September
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications Santee, Calif. — 28 September 2022 — StratEdge Corporation, leader...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
StratEdge Offers Assembly Services for Die Attachment on CMC Tabs
Experts available at BCICTS 2022 and IMAPS 2022 to analyze your high-frequency packaging needs Santee, Calif. — 9 September 2022 — StratEdge...
StratEdge Displays High-Performance Semiconductor Packages at IMS 2022, June 21-23, in Booth 4089
StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for radio frequency, microwave, and millimeter-wave devices, will display...
Getting a Reliable Signal: StratEdge’s High-Performance Power Amplifier Packages
Visit the experts at Space Tech Expo Booth 2019 Santee, Calif. — 18 May 2022 — StratEdge Corporation, leader in the...
StratEdge High-Power Semiconductor Packages will be Featured at CS MANTECH in Monterey, California
Santee, Calif. — 4 May 2022 — StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for...
2022 IMAPS DPC: Back and Better Than Ever
After two years of virtual conferences, it was great to be back in person last week at the 2022 IMAPS...
IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and...
From Macro to Micro: Learning Microelectronics Firsthand at StratEdge
I was fortunate enough to join StratEdge Corporation in May 2021 as an Engineering Technician working in the semiconductor packaging...
StratEdge to Present Glass Sidewall for Power Semiconductors and Ceramic Packages for 5G at IMAPS 2021 Live
Santee, Calif. — 30 September 2021 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages...
IMAPS 2021 Community Member Preview
The IMAPS 2021 program is set to be knowledge-packed, offering materials both in person and on demand, including keynote presentations...
StratEdge High-performance Semiconductor Packages to be on Display at IMS2021 Booth 1014
Santee, Calif. — June 7, 2021 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for...
StratEdge SMK Surface Mount Packages Support DC to 26 GHz Devices
Santee, Calif. — 27 April 2021 —StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave,...
