C2W Bonding Approaches: Variations on Theme
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields and the ability to stack dies of different sizes — especially in memory/logic stacks — a number of approaches have been or are being developed by various collaboratives. At IMAPS...
EV Group: Progress on Advanced C2W Bonding
When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking known-good-die (KGD) for best yields, or if the dies being stacked are of different size. Unfortunately, sequential C2W processes have historically been time consuming, achieving low throughput; making it a...
SPTS Begins 2010 with Solid Q1 Shipments of US$40M
SPP Process Technology Systems Ltd. (SPTS), announced shipments of US$40 million during the first quarter of 2010. SPTS was formed in October 2009 to merge Surface Technology Systems plc (STS) and assets acquired from Aviza Technology, Inc., including the single wafer process equipment subsidiary Aviza...
Alchimer in Asia: Things are Cooking
I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how things have progressed since news of Panasonic Investment Partners’ equity investment in the company back in July. It turns out setting up shop in Asia has been a great strategic...
Progress is Progress in the Medical Device World
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled. Not every year can be about earth-shattering...
Extending Legacy Technologies into the 3D Space
While TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D packaging approaches continue to make waves in the industry. It only stands to reason that for companies already involved in high-volume manufacturing either as a supplier, packaging foundry, or licensor...
New Realities for TSV Processing
In this article, published in the May/June 2010 issue of Chip Scale Review Magazine, Steve Lerner, CEO, Alchimer, proposes a "variation on theme" for TSV cost-of-ownership.
3D integration and More-than-Moore are popular topics in the semiconductor industry, with
Alchimer creates launch pad for industrialization
Launching a disruptive technology into an industry that is set in their ways is not a job for sissies. But Alchimer’s CEO, Steve Lerner, is clearly a man of action.
Suppliers offer solutions to TSV formation challenges
As part of the 3D tracks at both this year’s International Wafer Level Packaging Conference, held October 27-30 in Santa Clara, CA; and the 2009 IMAPS International Symposium, held Nov 3-5 in San Jose, CA, several suppliers offered up solutions addressing current limitations in via etch, insulation/barrier/seed layers, and...
