New Realities for TSV Processing
In this article, published in the May/June 2010 issue of Chip Scale Review Magazine, Steve Lerner, CEO, Alchimer, proposes a "variation on theme" for TSV cost-of-ownership.
3D integration and More-than-Moore are popular topics in the semiconductor industry, with
Alchimer creates launch pad for industrialization
Launching a disruptive technology into an industry that is set in their ways is not a job for sissies. But Alchimer’s CEO, Steve Lerner, is clearly a man of action.
Suppliers offer solutions to TSV formation challenges
As part of the 3D tracks at both this year’s International Wafer Level Packaging Conference, held October 27-30 in Santa Clara, CA; and the 2009 IMAPS International Symposium, held Nov 3-5 in San Jose, CA, several suppliers offered up solutions addressing current limitations in via etch, insulation/barrier/seed layers, and...
