Latest Posts
Material Value: A Narrative About More Sustainable, Less Wasteful Manufacturing
While I’m only four chapters into Material Value written by my colleague and SemiSister, Julia Goldstein, I decided to write...
Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology
When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level...
