QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power MarketsAug 19, 2021 · By QP Technologies · Press Releases ESCONDIDO, Calif. – August 16, 2021 – QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly...
YES Receives VertaBond™ Purchase Order from a Tier 1 Memory ManufacturerMar 19, 2021 · By YES · Press Releases FREMONT, Calif. – Mar 15, 2021 – YES (Yield Engineering Systems, Inc.), a preferred provider of material modification and surface...
FINETECH Debuts NEW FINEPLACER FEMTOBLU Micro Assembly Cell for Photonic Component AssemblySep 14, 2020 · By Finetech · Press Releases FINETECH, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu...