IMAPS 49th Annual International Symposium on Microelectronics takes place October 10th to 13th at the Pasadena Convention Center in Pasadena, California. The IMAPS committees and volunteers have spent the past six months revamping the IMAPS 2016 program to create a balance between emerging, new and mature topics, and a large cross-section of vendors exhibiting their products and technologies in the exhibition hall. As a result, the 2016 Symposium will feature exciting topics that are relevant within the microelectronics community. technical sessions with topics ranging from high-reliability systems to fan-out wafer level and embedded packages. The conference theme for
The conference theme for IMAPS 2016 is “Packaging the Connected World.” Building on the successes of the previous symposia, the technical program in 2016 will also run parallel tracks covering:
- EMERGING APPLICATIONS & THE CONNECTED WORLD
- 2.5/3D PACKAGING & EMBEDDED PACKAGING TECHNOLOGIES
- ADVANCED PACKAGING AND ENABLING TECHNOLOGIES
- ADVANCED MATERIALS & PROCESSES and
- MODELING, DESIGN, TEST & RELIABILITY
Complementing the technical sessions will be Professional Development Courses (PDCs) with a variety of topics bound to enhance and broaden your technical portfolio. This will be held on Monday, October 26, prior to the kick-off of the technical sessions.
The IMAPS Exhibition returns featuring a 2-day show floor with more than 120 exhibit booths already reserved, featuring companies and research labs that will showcase a vast array of new products serving all segments of the microelectronics industry, including Consumer, Healthcare and Biomedical, Military, Aerospace, Computing, and Automotive/Industrial. Browsing the exhibit hall and talking to the exhibitors are bound to be exciting and we hope that this enables you to learn the latest and greatest solutions to the changing needs of your business and research.
We hope you can take some time from your busy schedules to attend IMAPS 2016, to learn about the changing world of microelectronics packaging in the 21st century.
Early Registration & Hotel Deadlines: September 14, 2016
