The Electronic Design Processes (EDP) 2013 Symposium, now in its 20th year, fosters the free exchange of ideas among the top thinkers, movers, and shakers who focus on how chips and systems are designed in the electronics industry. It provides a forum for this cross-section of the Design community to discuss state-of-the-art improvements to electronics design processes and CAD methodologies, rather than on the functions of the individual tools themselves.
3D IC topics will be covered on Thursday, with a keynote by Xilinx CTO Ivo Bolsens who will discuss the company’s Zynq All Programmable SoC platform and 3D packaging in the context of building smarter systems that deliver higher performance. Bolsens will also serve on a 3D IC panel with Mentor Graphics’ Dusan Petranovic, Cadence’s Brandon Wang, Micron’s Mike Black, EDA Analyst Gary Smith, and Herb Reiter, is president of EDA2 ASIC. You can read more about this event in this blog post on Programmable Planet, by Steve Leibson.
