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SEMICON West 2014: Supplier Updates for 2.5D and 3D Processes

SEMICON West 2014: Supplier Updates for 2.5D and 3D Processes

SEMICON West 2014 brought its usual flurry of supplier announcements on new equipment and process improvements; but there weren’t as many focused on 3D technologies as there have been in past years. This is likely due to the fact that some players are holding off until 3D hits it big and they get some return on their investment. But for the true die-hards, they’re not letting a little thing li... »

KLA Tencor: CV310i Wafer Edge Inspection and Metrology Module

KLA Tencor: CV310i Wafer Edge Inspection and Metrology Module

CIRCL CV310i module is an advanced Wafer Edge inspection, metrology and profiling system tailored for Advanced Wafer Level Packaging. Simultaneous wafer edge inspection and metrology enables comprehensive data collection from all zones comprising the wafer’s edge: top and bottom near-edge; top and bottom bevel; and apex. Testimonial Some of the critical process steps in the 3D integration proces... »

SSEC: Wet Etch Process for TSV Reveal

SSEC: Wet Etch Process for TSV Reveal

SSEC’s wet TSV reveal process achieves -/+ 0.7% Si thickness uniformity under the appropriate post grinding conditions with fast throughput. The two-step process starts with a spin etch for a smooth, fast etch at 10µm/min. The etch is stopped 2µm above the TSVs and then finishes with a selective etch process (Si:SiO2 >2,500) to endpoint on the TSV based on Si thickness measurements done on ... »

Akrion Systems: Vacuum Prime and Dry

Akrion Systems: Vacuum Prime and Dry

Akrion Systems’ vacuum prime and drying technology enables the use of a wet immersion method to introduce liquid chemicals or rinse water throughout the entire HAR feature prior to the oxide etching step.  Pulling a vacuum below the saturated vapor pressure of water, draws liquid into the entire feature, enabling a uniform oxide etch. Testimonial Surface preparation is important for 3D IC, part... »

SORIN CRM: 3D IC Module for Active Medical Implant

SORIN CRM: 3D IC Module for Active Medical Implant

Manufacturing of 3D IC heterogeneous integrated modules for the electronics of a leadless pacemaker in a very small volume has been realized. Manufacturing of 3D IC modules using the described process is ready for medium volume production. Testimonial All the electronics of a leadless pacemaker has been integrated into a 3D IC heterogeneous module within size of 2.3*5.2*7.3mm³. The same electroni... »

SETNA: Process for Room Temperature 3D IC Assembly

SETNA: Process for Room Temperature 3D IC Assembly

SETNA, in conjunction with Research Triangle Institute (RTI), has developed a binary alloy (Silver-to-Indium) bonding system for 3D IC assembly that can be compression-bonded at room temperature. Following 3D IC chip stacking, the Ag-In structure is annealed in the solid-state (no melting) to form an Ag₂In interconnect which is stable to greater than 600℃. Testimonial Room-temperature bonding ... »

Schiltron 3D Flash

Schiltron 3D Flash

Schiltron 3D Flash replaces 2D-NAND. It uses a unique architecture solving key challenges associated with other 3D-NAND approaches: scalable; no vanishing string currents; uses existing Fab infrastructure and materials; uses existing design approaches for program and erase; endurance of over a million cycles; post-cycling retention of more than 10 years at 85℃. Testimonial The Schiltron 3D Flash... »

SPTS: Blanket Silicon Etch Process for Via Reveal

SPTS: Blanket Silicon Etch Process for Via Reveal

The blanket silicon etch process performed on the SPTS Rapier XE achieves an etch rate >8.5µm/min, high selectivity (Si:SiO>150:1), and is ~3-4x faster than competing systems. A unique dual plasma source design creates a uniform etch (<±3%) across a 300mm wafer, which can be “tuned” to compensate for variations in in-coming wafer thicknesses. Testimonial Via reveal is a 2.5D/3D tec... »

Novati Technologies: Silicon Interposer Module

Novati Technologies: Silicon Interposer Module

The 2.5D Interposer Module features three front-side interconnect layers of dual-damascene copper on top of a single-damascene copper metal layer, with 2µm Line/Space/Thickness interconnect dimensions. The via-first TSVs are copper-filled with a 10:1 aspect ratio and via-last TSVs are copper-lined, polyimide-filled with a 5:1 aspect ratio, both with 50µm pitch. Testimonial In addition to increas... »

E-System Design: Sphinx 3D Path Finder (“3DPF”) V3.0

E-System Design: Sphinx 3D Path Finder (“3DPF”) V3.0

The Sphinx 3D Path Finder (3DPF) is an exploration tool enabling fast test case creation and analysis for silicon and glass interposers containing: solder balls, pillars, bond wires, TSV/TSG as well as RDL interconnect structures. E-System Design: Sphinx 3D Path Finder (“3DPF”) V3.0 All based upon a patented simulation engine with the accuracy of full wave electromagnetic solvers. Te... »

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