NHanced Semiconductor Advanced Packaging Technologies
2023 Edition. In Device Technology of the Year
NHanced has combined multiple Advanced Packaging technologies creating a single device incorporating silicon interposer, quilt packaging (developed by Indiana Integrated Circuits), plasma dicing, and 3D bonding. This breakthrough device required dealing with several interacting processes and pushed the boundaries of each of them. This demonstration, mixing multiple AP techniques, is a glimpse into the future of semiconductors.