Through its collaboration with BRIDG and imec, Skywater has been working hard to create a U.S. based advanced packaging hub. Most notably, the company made headlines developing a baseline fabrication flow for silicon bridge interposers, which are increasingly used in heterogeneous integration applications. Elements of the phase one bridge interposer capability will also be used in subsequent phases of the silicon interposer development program, where through-silicon vias (TSV) and RF-enabling materials and devices will be incorporated. The technology is available to both government and commercial customers.