Incorporated in 2021, Chipletz sells Smart Substrateā„¢ products, an advanced packaging technology which bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. Chipletz targets AI workloads, immersive applications, and high-performance computing systems. Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. The company was formed by a team of skilled engineers with decades of experience in semiconductor design, manufacturing, and packaging to address that need. Chipletz is pushing the system-in-package concept into the future and offering a path forward that will enable years of additional performance increases while resetting the economic model for semiconductor integration.